Tu Munich
Entity.
- Evidence
- 20 documents Β· 7 separate publishers
- Standing
- Added automatically from coverage
- Time
- first seen 7 Sept 2026, last seen 26 Oct 2026
- Measured
- 0% of mentions say something specific about it; the rest only name it
- As of
- 26 Oct 2026
Where this comes from
- Semiconductor Engineering Β· 2026-10-25 Β· Neural Networks Speed 3nm Nanosheet SPICE Simulation (TU Munich) (opens the source in a new tab)
- semiengineering.com Β· 2026-10-03 Β· Tracing Hardware Design From Physical Devices to RTL (Infineon, TU Munich) (opens the source in a new tab)
- semiengineering.com Β· 2026-09-20 Β· Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech) (opens the source in a new tab)